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| MBRS3201T3 200V, 3A Schottky Fast Soft-Recovery Power Rectifier SMC Power Surface Mount Package http://onsemi.com Features * Lower Forward Voltage than any Ultrafast Rectifier: * * * * * * * * VF < 0.59 V at 150C Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns Soft Recovery Characteristics: Softness Factor (tb/ta) w 1 Highly Stable Over Temperature Pb-Free Package is Available SCHOTTKY RECTIFIER 3 AMPS, 200 VOLTS Benefits Significantly Reduced EMI Eliminates the Need of Snubber Circuits Low Switching and Heat Losses Improved Thermal Management SMC CASE 403 PLASTIC Applications * Engine and Convenience Control Systems * Motor Controls * Battery Chargers and Switching Power Supplies Mechanical Characteristics MARKING DIAGRAM * * * * * * Small Compact Surface Mount Package with J-Bend Leads Rectangular Package for Automated Handling Weight: 217 mg (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Maximum for 10 Seconds Polarity: Notch in Plastic Body Indicates Cathode Lead AYWW B321G G MAXIMUM RATINGS Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR, TC = 70C) Nonrepetitive Peak Surge Current Operating Junction Temperature Symbol VRRM VRWM VR IF(AV) IFSM TJ Value 200 Unit V B321 = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package SMC SMC (Pb-Free) Shipping 2500 / Tape & Reel 2500 / Tape & Reel 3 100 -55 to +150 A A C MBRS3201T3 MBRS3201T3G Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2005 1 August, 2005 - Rev. 2 Publication Order Number: MBRS3201T3/D MBRS3201T3 THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction-to-Lead Thermal Resistance, Junction-to-Ambient Symbol RqJL RqJA Value 12 60 Unit C/W C/W ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage (IF = 3 A, TJ = 25C) (IF = 3 A, TJ = 150C) Maximum Instantaneous Reverse Current (Rated VR) (Rated DC Voltage, TJ = 25C) (Rated DC Voltage, TJ = 150C) Maximum Reverse Recovery Time (IF = 1 A, di/dt = 100 A/us, VR = 30 V) 100 100 trr IR 1.0 5.0 35 mA mA ns Symbol VF 0.84 0.59 Value Unit V IF, FORWARD CURRENT (A) 10 IF, FORWARD CURRENT (A) 10 25C 1.0 100C 150C 25C 1.0 150C 100C 0.1 0.2 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 VF, INSTANTANEOUS VOLTAGE (V) VF, INSTANTANEOUS VOLTAGE (V) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 1E-1 1E-2 IR, REVERSE CURRENT (A) 1E-3 1E-4 1E-5 1E-6 1E-7 1E-8 1E-9 0 20 40 60 80 25C 100C 150C IR, MAXIMUM REVERSE CURRENT (A) 1.0E-01 1.0E-02 TC = 150C 1.0E-03 TC = 25C 1.0E-04 1.0E-05 100 120 140 160 180 200 1.0E-06 0 20 40 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current http://onsemi.com 2 MBRS3201T3 1000 C, CAPACITANCE (pF) 100 10 1.0 0 20 40 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (V) Figure 5. Typical Capacitance PFO, AVERAGE POWER DISSIPATION (W) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 IO, AVERAGE FORWARD CURRENT SQUARE DC IF, AVERAGE FORWARD CURRENT (A) 7 6 5 4 3 2 1 0 80 SQUAREWAVE DC 90 100 110 120 130 140 150 160 TL, LEAD TEMPERATURE (C) Figure 6. Power Dissipation Figure 7. Derating Curve http://onsemi.com 3 MBRS3201T3 PACKAGE DIMENSIONS SMC CASE 403-03 ISSUE E HE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. 4. 403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03. DIM A A1 b c D E HE L L1 MIN 1.90 0.05 2.92 0.15 5.59 6.60 7.75 0.76 MILLIMETERS NOM MAX 2.13 2.41 0.10 0.15 3.00 3.07 0.23 0.30 5.84 6.10 6.86 7.11 7.94 8.13 1.02 1.27 0.51 REF MIN 0.075 0.002 0.115 0.006 0.220 0.260 0.305 0.030 INCHES NOM 0.084 0.004 0.118 0.009 0.230 0.270 0.313 0.040 0.020 REF MAX 0.095 0.006 0.121 0.012 0.240 0.280 0.320 0.050 b D A c A1 L L1 SOLDERING FOOTPRINT* 4.343 0.171 3.810 0.150 2.794 0.110 SCALE 4:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 4 MBRS3201T3/D |
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